Computer-on-Modules (COMs) are compact, ready-to-use electronic assemblies designed for embedded systems. They combine all essential components of a computer system allowing you to focus entirely on the development of application-specific functions. The pre-integrated components significantly reduce the development effort - accelerating your time-to-market.
With a wide range of plug-in and solder-in COM options, we offer solutions tailored to diverse technical requirements—including varying levels of performance, size, and connectivity.
For a quick overview, our COM comparison offers a structured presentation of all products - sorted by product type and module specifications. Our intuitive product filter helps you refine your selection based on key technical parameters, making it easier to find the perfect fit for your application. Additionally, detailed data sheets provide in-depth specifications to support your decision-making.
Selecting the ideal Computer-on-Module is essential for optimizing performance, efficiency and scalability in your embedded application. Our portfolio includes two distinct module families, each designed to meet specific requirements:
- QS Solder-in Modules – Ultra-compact and robust for space-constrained applications.
- TX Plug-in Modules – Maximum flexibility for easy development and module replacement.
Both series ensure long-term scalability, enabling seamless upgrades to more powerful variants or the latest technological standards—without requiring major changes to your existing hardware. Our product overview provides a clear, side-by-side comparison of key features such as
processor performance, memory capacity, and power supply, helping you quickly identify the best solution for your needs.
Our COM filter streamlines the selection process, allowing you to quickly identify the perfect module for your embedded system. Its intuitive interface saves valuable time and accelerates your time-to-market.
Filter by key specifications:
- Processor
- Cores & Frequency
- Memory Capacity
- Multimedia Interfaces
- Module Family
- Temperature Range
For a more in-depth evaluation, detailed data sheets with all technical specifications are available in the product listings. Find the optimal solution in just a few clicks—efficiently, clearly, and precisely tailored to your requirements.
QS solder-in computer-on-module family
1-glmark2 | 2-CoreMark | 3-DhryStone | 4-Whetstone [MIPS] | 5-Memcpy [MB/s] | 6-Memset [MB/s] | 7-STREAM copy [MB/s] | 8-STREAM scale [MB/s] | 9-STREAM add [MB/s] | 10-STREAM triad [MB/s]
TX plug-in computer-on-module family
1-glmark2 | 2-CoreMark | 3-DhryStone | 4-Whetstone [MIPS] | 5-Memcpy [MB/s] | 6-Memset [MB/s] | 7-STREAM copy [MB/s] | 8-STREAM scale [MB/s] | 9-STREAM add [MB/s] | 10-STREAM triad [MB/s]
Select products by using filters, the results are displayed below.
QS8M
NXP i.MX 8M Mini 1.6 GHz Quad Cortex®-A53 NXP i.MX 8M Nano 1.4 GHz Dual Cortex®-A53 | |
512MB/1GB DDR3L, 4GB eMMC | |
-25 °C to 85 °C | |
27 x 27 x 2.3 mm | |
Datasheet | |
Getting Started |
QS91
NXP i.MX91 1.4 GHz Cortex®-A55 | |
512 MB LPDDR4, 4GB eMMC | |
-25 °C to 85 °C | |
27 x 27 x 2.7 mm | |
Datasheet | |
Getting Started |
QS93
NXP i.MX93 1.7 GHz Dual Cortex®-A55 | |
1GB LPDDR4, 4GB eMMC | |
-40 °C to 85 °C | |
27 x 27 x 2.7 mm | |
Datasheet | |
Getting Started |
QSMP-13
STM32MP135C 650 MHz Cortex®-A7 | |
256MB DDR3L, 4GB eMMC | |
-25 °C to 85 °C | |
27 x 27 x 2.3 mm | |
Datasheet | |
Getting Started |
QSMP-15
STM32MP157C 650 MHz Dual Cortex®-A7 | |
256/512MB DDR3L, 4GB eMMC | |
-25 °C to 85 °C | |
27 x 27 x 2.3 mm | |
Datasheet | |
Getting Started |
QSMP-23
1.2GHz Dual ARM® Cortex®-A35 based STM32MP255 | |
1GB LPDDR4, 4GB eMMC | |
-40 °C to 85 °C | |
27 x 27 x 2.6 mm | |
Datasheet | |
Getting Started |
QSMP-25
1.5GHz Dual ARM® Cortex®-A35 based STM32MP255 | |
1GB LPDDR4, 4GB eMMC | |
-40 °C to 85 °C | |
29 x 29 x 2.6 mm | |
Datasheet | |
Getting Started |
QSRZ
RENESAS RZ/G2L 1.2 GHz Dual Cortex®-A55 | |
512MB/1GB DDR3L, 4GB eMMC | |
-40 °C to 85 °C | |
27 x 27 x 2.7 mm | |
Datasheet | |
Getting Started |
QSXM
NXP i.MX 8M Mini 1.6 GHz Quad Cortex®-A53 | |
2GB LPDDR4, 4GB eMMC | |
-25 °C to 85 °C | |
29 x 29 x 2.6 mm | |
Datasheet | |
Getting Started |
QSXP
NXP i.MX 8M Plus 1.6 GHz Quad Cortex®-A53 | |
2GB LPDDR4, 8GB eMMC | |
-30 °C to 85 °C | |
29 x 29 x 2.6 mm | |
Datasheet | |
Getting Started |
TX8M
NXP i.MX 8M Mini 1.6 GHz Quad Cortex®-A53 | |
1GB/2GB DDR3L, 4GB eMMC | |
-25 °C to 85 °C | |
68 x 26/28 x 4 mm | |
Datasheet | |
Getting Started |
TX8P
NXP i.MX 8M Plus 1.6 GHz Quad Cortex®-A53 | |
2GB LPDDR4, 8GB eMMC | |
-30 °C to 85 °C | |
68 x 26 x 4 mm | |
Datasheet | |
Getting Started |
TX91
NXP i.MX91 1.4 GHz Cortex®-A55 | |
512MB LPDDR4, 4GB eMMC | |
-25 °C to 85 | |
68 x 26 x 4 mm | |
Datasheet | |
Getting Started |
TX93
NXP i.MX93 1.7 GHz Dual Cortex®-A55 | |
1GB LPDDR4, 4GB eMMC | |
-25 °C to 85 °C | |
68 x 26 x 4 mm | |
Datasheet | |
Getting Started |
TXMP
STM32MP157C 650 MHz Dual Cortex®-A7 | |
512MB DDR3L, 4GB eMMC | |
-25°C to 85°C | |
68 x 26 x 4 mm | |
Datasheet | |
Getting Started |
TXMP2
1.5 GHz Dual ARM® Cortex®-A35 based STM32MP255 | |
1GB LPDDR4, 4GB eMMC | |
-40°C to 85°C | |
68 x 26 x 4 mm | |
Datasheet | |
Getting Started |
TXRZ
RENESAS RZ/G2L 1.2 GHz Dual Cortex®-A55 | |
512MB/1GB DDR3L, 4GB eMMC | |
-40 °C to 85 °C | |
68 x 26 x 4 mm | |
Datasheet | |
Getting Started |