QSRZ

• High Performance
  64-bit Arm Cortex-A cores, plus powerful 3D graphics engine and video engine capable of supporting up to 4K UHD, to offer the highest performance
• Wide Coverage
  Entry-level RZ/G2L Group 3 products equipped with Cortex-A55 with improved processing performance have been newly added to the RZ/G2 lineup
• High Reliability
  Built-in Error Correction Code (ECC) for internal and external memory, which is essential for high-reliability mission critical systems
• Super Long Term Support (SLTS)
  Applying Civil Infrastructure Platform (CIP) Linux, the Linux kernel will be provided with over 10 years of support
• Verified Linux Package
  Renesas verifies and provides a Linux package that combines CIP and Linux basic software. Minimize your Linux maintenance resources

Solder-Down
System-on-Module
Simplifies Design & Production
 

A SoM, one step above an SoC, incorporates connectivity, multimedia and display, GPIO, operating system, and others in a single module. Although the industry has been traditionally using SODIMM modules (such as push-connector modules, small outline dual in-line memory module), soldered SoM modules are rapidly gaining ground.  Solder modules are less expensive than their SODIMM counterparts because they are easier to manage, test in production, and allow for better economies of scale.

SoM-based designs are usually scalable to achieve a fully customized electronics assembly in terms of interfaces and form factors. SoMs can be replaced or upgraded within a carrier board. Some advantages of the SoM approach over an SoC development include cost savings, reduced market risk, reduced customer design requirements, and footprint.  The only limitation with an SoM, when compared to the ground-up SoC design, is that there are fewer pins in an SoM.