NXP i.MX 8M Plus 1.6 GHz Quad Cortex®-A53 | |
2GB LPDDR4, 8GB eMMC | |
-30 °C to 85 °C | |
29 x 29 x 2.6 mm | |
Datasheet | |
Getting Started |
Our new QSXP Series is a QFN Style Solder-Down Computer On Module. The module with a small square size of 29 mm and a height of 2.6 mm is single-sided assembled. Its QFN type lead style has a 1 mm pitch with 108 pads. The ground pad additionally acts as a thermal pad.
i.MX 8M Plus Applications Processor
Machine learning, vision, advanced multimedia and industrial IoT applications
Solder modules can be used just like any other component
Hardware and software integration of the newest 64-bit ARM-processor is becoming increasingly more sophisticated. Integrating everything on a single board can create some engineering challenges. Once a fully custom SoC-based board is built, it can’t be modified without delay and expense. That’s why it’s vital to know what its destination is before you design it. Despite this precaution, porting Linux or another OS to the custom hardware is an onerous task. To overcome this limitation, a SoM offers much more flexibility as the porting is already done. To further reduce costs, most projects are turning to module-based systems to increase time available for application development, reduce complexity and allow designers to focus on their core competencies.
Solder modules can be used just like any other component, and do not need to be handled and inserted manually like a SODIMM. With increasing demands on miniaturization, a SODIMM module requires more space and this can be important. The smallest soldered modules are only 27mm2 (1.1″) and this is the smallest space on which it is physically possible to mount the basic components.
In all types of designs, the connector has its cost. Even a SODIMM200 connector can cost a couple of dollars and push-fit connectors can cost a lot more. Soldering offers considerable strength and therefore the components are less vulnerable to shock and vibration.
The solder-down module’s integral ground plane provides a defined return path, avoiding ground loops and allowing efficient routing of tracks with low EMI. High-speed differential signals can be easily routed on a single layer. The ground plane also aids heat transmission to the baseboard, reducing the need for heat sinks.
In projects with BGA solutions, designers might face various problems. BGAs are very good for density, but they need high precision and it can only be inspected by through x-ray. SoMs in contact with the edges prove to be a better solution as it is possible to visually inspect the connections.
Pre-programmed
All modules will be shipped with a pre-programmed bootloader by default. To speed up the production process, the modules can also be pre-programmed to customer specifications. JEDEC version 5.0 introduces “Production State Awareness” to help avoid possible data corruption during soldering. Only a predefined part of the whole device’s available space can be supported by this feature.
Development Kits
QSBASE4 Evalkit
Linux pre-installed and ready for application development. Other features include:
- QS module on sockets
- Gb Ethernet
- MIPI Display Connector
- Two port USB hub, type A connectors
- USB client & power supply, type C connector
- USB to UART bridge, micro-B connector
- 4-layer PCB
QSBASE4 on Raspberry Pi Touchscreen
The QSBASE4 EvalKit can be mounted directly to the official Raspberry Pi 7 inch Touch screen.
- Touch Display works out of the Box.
- Sources available in our Yocto Layer.
- Only version 1.1 is supported.
Variants
An overview of the current standard variants.
Customized versions on request.
Part Number | QSXP-ML81 |
Part Name | QSXP/ML8C/2GS/8GF/E85 |
Processor | NXP i.MX8M Plus Quad 1.6 GHz |
SDRAM | 2 GiB |
Flash | 8 GiB |
Display-IF | MIPI |
Temperature | -30 °C to 85 °C |
Socketed Version
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Part Number | QSXP-ML81/SOCK |
Documentation
Customer Area File History
Software
Long Term Linux Kernel 5.15 Support
Yocto Gatesgarth and Hardknott Support
Debian 11 (“bullseye”) Support
Neural networks on embedded devices
Build cross-platform desktop apps
Qt5 Cross-Platform Framework
Cross-Compile and Debug your C apps
QS-Standard
Benefit by using QS module family
The QS module family has very compact dimensions. They include a complete embedded System on Module with processor, PMIC, RAM and flash memory.
Because of the very dense packaging on the top side, there are no components on the bottom side of the module, cut-outs on the base board not required. The pin compatible family concept provides all important interfaces needed for embedded designs, e.g., USB, Gigabit-Ethernet, display and many serial interfaces.
Flexibility, high performance and easy integration
All signal connections located at the module edges, allowing easy optical inspection during production. The modules can be assembled by automatic pick & place machines without any mechanical assembly work necessary.
The pin-optimized QS concept enables the use of a simple, cost-effective 2-layer base board.
A development kit with schematics and bill of materials is available to support a quick evaluation and project start.
QSX vs. QS
- QSX is a QS module enlarged by 1 mm all around.
- The size hereby increased from 27 mm square to 29 mm square.
- In each corner this gives additional space for a total of 8 further pads which are used for PCIe and USB3.
- The inner 27 mm x 27 mm QS area remains identical, providing full compatibility.
Product comparison
QS Modules - Quick Selection Low to High End
part number | part name | CPU | MPU | # | MHz | MCU | MHz | RAM | ROM | GPU | VPU | NPU | Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
QSMP-1351 | QSMP/135C/256S/4GF/E85 | STM32MP135 | A7 | 1 | 650 | - | - | 256 MB | 4 GB | - | - | - | -25°C..85°C |
QSMP-1530C | QSMP/157C/256S/4GF/E85 | STM32MP157 | A7 | 2 | 650 | M4 | 209 | 256 MB | 4 GB | Y | - | - | -25°C..85°C |
QSMP-1570 | QSMP/157C/512S/4GF/E85 | STM32MP157 | A7 | 2 | 650 | M4 | 209 | 512 MB | 4 GB | Y | - | - | -25°C..85°C |
QS91-3110 | QS91/31C/512S/4GF/E85 | i.MX 91 | A55 | 1 | 1400 | - | - | 512 MB | 4 GB | - | - | - | -25°C..85°C |
QS8M-ND00 | QS8M/ND/1400/512S/4GF/E85 | i.MX 8M Nano | A53 | 2 | 1400 | M7 | 600 | 512 MB | 4 GB | Y | - | - | -25°C..85°C |
QSRZ-G2L1 | QSRZ/G2L/512S/4GF/I | RZ/G2L | A55 | 2 | 1200 | M33 | 200 | 512 MB | 4 GB | Y | Y | - | -40°C..85°C |
QS93-5210 | QS93/52C/1GS/4GF/I | i.MX 93 | A55 | 2 | 1700 | M33 | 250 | 1 GB | 4 GB | - | - | 0.5 TOPS | -40°C..85°C |
QSRZ-G2L0 | QSRZ/G2L/1GS/4GF/I | RZ/G2L | A55 | 2 | 1200 | M33 | 200 | 1 GB | 4 GB | Y | Y | - | -40°C..85°C |
QSMP-2550 | QSMP2/255F/1GS/4GF/I | STM32MP255 | A35 | 2 | 1500 | M33 | 400 | 1 GB | 4 GB | Y | Y | 1.35 TOPS | -40°C..85°C |
QS8M-MQ00 | QS8M/MQ/1600/1024S/4GF/E85 | i.MX 8M Mini | A53 | 4 | 1600 | M4 | 400 | 1 GB | 4 GB | Y | Y | - | -25°C..85°C |
QSXM-MM60 | QSXM/MM6C/2GS/4GF/E85 | i.MX 8M Mini | A53 | 4 | 1600 | M4 | 400 | 2 GB | 4 GB | Y | Y | - | -25°C..85°C |
QSXP-ML81 | QSXP/ML8C/2GS/8GF/E85 | i.MX 8M Plus | A53 | 4 | 1600 | M7 | 800 | 2 GB | 8 GB | Y | Y | 2.3 TOPS | -25°C..85°C |