QSXM Facts
ProcessorNXP i.MX 8M Mini
CoresQuad Cortex®-A53, 1.6 GHz
Flash4 GB eMMC
Extra features compared to QS8MPCIe, LPDDR4, 3.3-5V power supply
Temperature-25 °C to 85 °C
Dimensions (LxWxD)29 mm x 29 mm x 2.6 mm
Datasheets QSXM

The QS module family has very compact dimensions. They include a complete embedded System on Module with processor, PMIC, RAM and flash memory.

Because of the very dense packaging on the top side, there are no components on the bottom side of the module, cut-outs on the base board are not required. The pin compatible family concept provides all important interfaces needed for embedded designs, e.g. USB, Gigabit-Ethernet, display and many serial interfaces.

All signal connections are located at the module edges, allowing easy optical inspection during production. The modules can be assembled by automatic pick & place machines without any mechanical assembly work necessary.

The pin-optimized QS concept enables the use of a simple, cost-effective 2-layer base board.

A development kit with schematics and bill of materials is available to support a quick evaluation and project start.


Target Markets

Embedded computing power is very much in demand in a growing number of multimedia-centric devices. The Ka-Ro QS8M is ideally suited for target markets requiring high-end devices for powerful images and impressive video streaming creating connected devices in the following vertical markets.

  • Automation
  • Medical technology
  • Industrial control
  • Digital signage
  • Transportation
Processor features

By combining the power-efficient processing capabilities of the ARM Cortex-A53 architecture with bleedingedge 3D and 2D graphics, the i.MX 8M Mini/Nano provides a new level of multimedia performance to enable an unbounded next-generation user experience.

For more information regarding i.MX 8 processors, see the NXP product page:

Module Connectivity
  • Gb Ethernet (RGMII)
  • PCIe
  • S/PDIF TX & RX
  • I²S/SAI
  • 2x USB2.0
  • 3x UART
  • 2x I²C
  • 1x PWM
  • 2x SPI
  • 1x MIPI CSI (4-lane) camera interface
  • 1x MIPI DSI (4-lane) display interface
  • Up to 70 x 3.3V General Purpose I/O