QSMP Series Facts
ProcessorSTM32MP1 Series
RAMup to 512MB DDR3L
Flash4GB eMMC, SLC NAND on request
GradeIndustrial
Temperature-25°C to 85°C (eMMC) / -40°C to 85°C (NAND)
Dimensions (LxWxD)27mm x 27mm x 2.3mm
Datasheets QSMP
Target Markets

Embedded computing power is very much in demand in a growing number of multimedia-centric devices. The Ka-Ro QSMP is ideally suited for target markets requiring high-end devices for powerful images and impressive video streaming creating connected devices in the following vertical markets.

  • Automation
  • Medical technology
  • Industrial control
  • Digital signage
  • Transportation
Processor features

A general-purpose microprocessor portfolio enabling easy development for a broad range of applications, the STM32MP1 series is based on a heterogeneous single or dual Arm Cortex-A7 and Cortex-M4 cores architecture, strengthening its ability to support multiple and flexible applications, achieving the best performance and power figures at any time.

For more information regarding the STM32MP1 Series go to st.com:

Module Connectivity
  • Ethernet
  • USB 2.0
  • eMMC/SD
  • UART
  • I²C
  • SPI
  • PWM
  • SAI
  • CAN

 

With only 27mm x 27mm the QS module family has very compact dimensions. They include a complete embedded System on Module with processor, PMIC, RAM and flash memory.

Because of the very dense packaging on the top side, there are no components on the bottom side of the module, cut-outs on the base board are not required. The pin compatible family concept provides all important interfaces needed for embedded designs, e.g. USB, Gigabit-Ethernet, display and many serial interfaces.

 

All signal connections are located at the module edges, allowing easy optical inspection during production. The modules can be assembled by automatic pick & place machines without any mechanical assembly work necessary.

The pin-optimized QS concept enables the use of a simple, cost-effective 2-layer base board.

To support a quick evaluation and project start, a starter kit, with included schematics and bill of materials, is available.

 

Flexibility, high performance and easy integration