SMT manufacturing line 1
High Speed Glue Dispenser
- Speed: 40 000 glue dots per hour
- Clock rate: 0.09 seconds per glue dot
- Repeatability precision: 51µm at 3 sigma
- Position recognition; passing markers are programmable
- PCB size: max. 457mm x 508 mm min. 51mm x 51mm
Precision Stencil Printer
- Speed: 600 PCBs an hour
- Clock rate: 6 seconds
- Alignment repeatability: 12.7 µm at 6 sigma
- Alignment accuracy: 25µm at 6 sigma
- Print area: 553mm x 502mm
- Camera system: air cushion-mounted, linear drive
- Position recognition: passing markers are programmable
- PCB size: max. 560mm x 508mm; min. 50mm x 25mm
High Speed Pick and Place Machine
- Speed: 36 000 parts/second
- Clock rate: 0.1 seconds per part
- Lead pitch: 0.5mm
- Precision of placement: 0.1mm
- Placing performance: 100 ppm = 99,99%
- Configuration: 16 part revolver head, 5 nozzles per head
- Position recognition: passing markers are programmable
- PCB size: max. 330mm x 250mm; min. 50mm x 50mm
High precision, fine-pitch pick-and-place machine
- Speed: 5600 parts/hour
- Clock rate: 0.64 seconds per part
- Repeatability precision: 8.9µm at 3 sigma
- Placing performance: 12.7µm at 1.5 sigma
- Capacity: 64 feeder stations + 30 matrix trays in the PTF
- Lead pitch: 0.3mm
- Camera: vision on the fly 2.6 mil per pixel
- Feeder capacity: 103 feeder stations
- PCB size: max. 356mm x 457mm
- Position recognition: passing markers are programmable
- Options: FlexJet, Platform Tray Feeder (PTF)
- Random Access Matrix Tray Feeder up to 30 waffles
rehm V7 Nitro 3.3B reflow soldering system (air/nitrogen)
Consistently well-designed technology and outstanding workmanship are standard features of the Vision7 reflow soldering system. It has been especially designed for soldering with air or nitrogen and for hardening SMD glues and meets the needs of user in the area of midrange manufacturing.
The whole SMT component spectrum, especially BGAs, can be processed. The V7 is manufactured according to the latest technologies and only materials of the highest quality are used. The use of forced convection for adequate air circulation assures optimized process reliability. The use of a nitrogen atmosphere for reflow soldering increases process reliability for components with small grids and for components without optimal wettability.
Unloader
- Programmable controller
- Clock rate: max. 15 seconds
- Capacity: four trays
- Tray size: max. 558.8mm x 508.0mm x 609.6mm
