In our THT (Through Hole Technology) manufacturing section, our qualified team members assemble your selected component groups according to DIN EN ISO 9001 and IPC-A-610D Class 2 regulations. Depending on your specific product needs, your component groups can be soldered by hand or on the wave soldering machine.

Manufacturing electronic components and systems is a highly complex process. The majority of products is manufactured with a combination of processes and in doing so the advantages of each production technique are combined.

By effective and precise interaction of our SMT (Surface Mount Technology) department and the latest machinery which we have available, Ka-Ro’s strength lies in the just-in-time production of highly complex component groups and systems.

RoHS compliant soldering of conventional component groups in a nitrogen environment is essential. The equipment we use at Ka-Ro is flooded with nitrogen during the whole soldering process.

Manufacturer: epm

Type: CIG400 compact TMS

Technical data:

• Carrier transport
• Carrier 400mm wide
• Standard wiring
• Atomizer fluxer
• Preheater with 12 infrared rays (short wave)
• TMS control, TMS software
• 450 kg solder pot, “body coated”
• Double wave (hollow and chip wave)